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SIDCOM: Sensing, Identification and Data Communication
with passive Non-Contact Technologies.
TCE: Technology Centres of Excellence.
SME: Small and Medium Enterprises.
ASIC: Application Specific Integrated Circuit.
FPGA: Field Programmable Gate Array.
PLD: Programmable Logic Device.
DSP: Digital Signal Processor (Processing).
CAD: Computer Aided Design.
PCB: Printed Circuit Board.
ZVEI: Zentralverband der Elektronikindustrie.
VDMA: Verband Deutscher Maschinen- und Anlagenbau.
MCM: Multi Chip Module.
AE: Application Experiment.
CEC: Commission of the European Communities.
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