Industrial Food Quality Control
Faster, More Accurate and Cheaper with Chip-on-Board-Based Silicon Imaging Sensor Module
Technologies used


Industrial sector (PRODCOM code)
    333 Industrial process control

Detection Technology Oy (DT) designs, manufactures and markets unique light and radiation detection components and modules. With 15 employees in Finland and 15 in its subsidiaries in China and Hong Kong, DT achieved the total sales of 1.8 million EUR in 1999.

Founded in 1991, DT concentrates on industrial and medical markets for light and radiation detectors. DT has thorough experience in silicon processing and encapsulation. It has also considerable knowledge in analogue ASIC and PCB design.

DT has two main product groups: light and radiation detector components and detector modules. Detector components include silicon photodiodes and amplifiers. The detector modules include x-ray linear array detectors and customer specific modules. The application areas for DT's products include paper and pulp manufacturing, foodstuff quality control, medical radiology, analytical chemistry and scientific applications. The object of this AE is the x-ray linear array detectors.

The objective is to improve this product by making its resolution (performance) better and lowering the manufacturing costs. The resolution of the old product is 2.5 mm and the new product 0.8 mm or 0.4 mm. The manufacturing costs of the product were at the same time lowered 43%. The resolution improvement will open completely new markets for this product group, for example in the demanding food quality control, where companies want to detect foreign objects, such as metal wires, stones and glass particles, in food. The CoB technology gave the capability of glass particle detection. The old technology is not suitable for making high-resolution detector arrays required in this field. Lowering the manufacturing costs will increase the profits and make the price competition easier for DT.

Chip-on-Board PCB was chosen as the technology for the new detector array. The AE duration was 14.5 months and the costs were approximately 90 kEUR, from which EU cover 86 kEUR. The payback period for this AE is very short, only 8 months and the ROI can is estimated to be 5 333%. The ROI is based on 5 years product lifetime. One must also take into account that the ASIC development (approximately 60 kEUR) was not part of this AE, but conducted as own development work, so the cost of that is not taken into account in these calculations.

The mixed-signal ASIC chip to be placed on-board has been designed internally during the project. The Chip-on-Board technology will definitely be later implemented to DT's other products making also them more competitive. During the project DT acquired a great amount of knowledge and skills, which it did not possess before the AE. DT considered the project very successful.

Detection Technology Oy
Micropolis, Piisilta 1
FIN-91100 Ii

Detailed information

You can also benefit from microelectronics

MCM technology provided Detection Technology Oy with the means of improving its products and enhancing its market position. You can also achieve significant benefits by acquiring the right microelectronics technology and utilising it in your product or manufacturing process. You can get help from FUSE to realise this.

FUSE is a technology transfer programme, funded by the European Commission to stimulate the wider use of microelectronics technologies by European enterprises to increase their competitiveness and enhance their economic growth. The demonstrator described here is one of many examples in the public FUSE portfolio covering the whole spectrum of microelectronics technologies and spanning a wide range of applications and industry sectors.

FUSE provides you with:

  • Best practice in acquiring specific microelectronics technologies and conducting full development projects through the FUSE portfolio of real life demonstrator documents.
  • Local training and expert support to plan your innovation realistically and help you conduct your project successfully.

Further information and support relating to this and other demonstrators can be obtained from the addresses below.

Further information   Guiding Technology Transfer Node
For further information and support regarding this case study, please contact a Technology Transfer Node (TTN) in your region.
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