Title
Low emission PCB for weighing machines
SMD technology in PCB design offers EMC compliance, increased reliability and reduced size and power consumption
Technologies used

 SMD - PCB

Industrial sector (PRODCOM code)
    332 Instruments and appliances for measuring/checking
Abstract
LEON ENGINEERING is well established in the industrial weighing sector. The company designs, develops, manufactures and markets a rich line of products ranging from simple and advanced scales, weighbridge, batching, dosing, filling, loss-in-weight, weighing in motion, piece counting, check weighing, networking, weight data collection and barcode labeling, and other weighing system applications. The company also exports electronic weighing machines to OEMs. The electronic part of these products consists mainly of microprocessor based PCBs.

The objective of the AE was to help LEON ENGINEERING to derive experience in the design of low emission – high immunity PCBs so as to gain EMC approval for its products. A representative instrument was chosen for the experiment namely D2000BCU weighing batching controller.

D1000/D2000 family is part of Leon Engineering products, with very satisfactory weighing performance but it failed the EMC test when the company applied for obtaining the European Approval. The major target of this AE was to design a main board to conform to the directives 89/336, 90/384.

The new main board is an SMD technology design providing emissions with very satisfactory safety margins and immunity levels above requirements. Additionally speed and memory capability has been increased. Size has been decreased enabling redesign of the models in smaller enclosures (1/3 of the initial volume) reducing manufacturing costs in some cases. The knowledge and experience obtained from the AE enhances the company’s engineers to redesign successfully existing and future products.

The duration of this AE was 11 months. The project started November 1st 1997 and ended at 30 September 1998. The actual budget was approximately 79 KECUs. Payback period is expected to be 11 months while the ROI on the FUSE investment is estimated to be 405%, three years after the introduction of the product into the market.
Company
LEON ENGINEERING Industrial Weighing and Process S.A.
41 Arkadias St. 115-27
Athens
Greece

Detailed information

You can also benefit from microelectronics

SMD - PCB technology provided LEON ENGINEERING with the means of improving its products and enhancing its market position. You can also achieve significant benefits by acquiring the right microelectronics technology and utilising it in your product or manufacturing process. You can get help from FUSE to realise this.

FUSE is a technology transfer programme, funded by the European Commission to stimulate the wider use of microelectronics technologies by European enterprises to increase their competitiveness and enhance their economic growth. The demonstrator described here is one of many examples in the public FUSE portfolio covering the whole spectrum of microelectronics technologies and spanning a wide range of applications and industry sectors.

FUSE provides you with:

  • Best practice in acquiring specific microelectronics technologies and conducting full development projects through the FUSE portfolio of real life demonstrator documents.
  • Local training and expert support to plan your innovation realistically and help you conduct your project successfully.

Further information and support relating to this and other demonstrators can be obtained from the addresses below.


Further information   Guiding Technology Transfer Node
For further information and support regarding this case study, please contact a Technology Transfer Node (TTN) in your region.
Homepage: http://www.fuse-network.com
INTRACOM
P O Box 68
GR-19´002 Peania Attika
Greece