Diode array using Chip on Board (COB) technology
COB reduces cost of diode array for wheel alignment by 20%
Technologies used

    Chip on Board (COB), LEDs

Industrial sector (PRODCOM code)
    332 Instruments and appliances for measuring, checking, testing etc.
    34 Parts and accessories for motor vehicles and their engines

CorkOpt Ltd. established in 1994 and based in Cork, Ireland, designs, manufactures, and markets Optoelectronic components for the European, USA and other markets. The principal product that was being manufactured is a 20 Element LED Array inserted in a Ceramic DIL package, which was in-turn, inserted in to an FR4 Printed Circuit Board.

The driving force for this project between the Sub Contractor and CorkOpt Ltd., transferring to chip-on-board technology, was manufacturing cost. Chip-on-board technology reduces our total direct costs per unit (on our LED arrays, which are presently our biggest volume component) by approximately 20%.

The second driving force behind the project was to improve the flexibility of production, allowing modifications to suit specific customer needs. The new technology allows the integration of miniaturised optics into the encapsulant. Additionally, we gained improved design flexibility due to product miniaturisation for our new designs of both LED arrays and Laser Diode Arrays. The project took approximately 11 months in total, which was three months more than originally planned.

By the end of the FUSE program we had achieved an understanding of Chip on Board technology which allows the company to incorporate the technology into our existing products and future products.

The total project cost was 30 KECU, with a payback period of 8 to 12 months. The expected ROI is seven times the initial investment.

This project would be particularly interesting to small companies with existing processes/products that would benefit from being converted to Chip on Board.


    CorkOpt Ltd.,
    Unit 12, Penrose Wharf,
    Penrose Quay,
    Cork, (Ireland)

Detailed information

You can also benefit from microelectronics

COB technology provided CorkOpt Ltd with the means of improving its products and enhancing its market position. You can also achieve significant benefits by acquiring the right microelectronics technology and utilising it in your product or manufacturing process. You can get help from FUSE to realise this.

FUSE is a technology transfer programme, funded by the European Commission to stimulate the wider use of microelectronics technologies by European enterprises to increase their competitiveness and enhance their economic growth. The demonstrator described here is one of many examples in the public FUSE portfolio covering the whole spectrum of microelectronics technologies and spanning a wide range of applications and industry sectors.

FUSE provides you with:

  • Best practice in acquiring specific microelectronics technologies and conducting full development projects through the FUSE portfolio of real life demonstrator documents.
  • Local training and expert support to plan your innovation realistically and help you conduct your project successfully.

Further information and support relating to this and other demonstrators can be obtained from the addresses below.

Further information   Guiding Technology Transfer Node
For further information and support regarding this case study, please contact a Technology Transfer Node (TTN) in your region.
Homepage: http://www.fuse-network.com
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