Prototype of a contactless transponder chip card employing flip-chip technology for the first time
Bar die technology allowed 60% cost reduction on transponder cards
Technologies used


Industrial sector (PRODCOM code)
    30 Computers and other Information Processing Equipment
    323 Television and Radio receivers, sound or video recording, etc.

A prototype transponder chip card employing a bare die technology (flip-chip) was realised by PAV CARD GmbH, Germany, in 12 month with a budget of 100.000 ECU. PAV CARD GmbH, a former printing company, has about 75 employees with three involved in electronic development. PAV CARD produces a wide range of ID cards like service and guarantee cards, club and credit cards, insurance IDs with and without magnetic strips. They also produce chip cards for policy holders and contactless transponder cards for ticketing and payment. The products are sold to a world-wide market.

The present chip card technology using prefabricated electronic modules with contact areas has been replaced by a custom made telemetric unit with a smart chip and an antenna foil carrying an etched inductivity. This advanced integration technology results in an ultra thin electronic assembly that can be laminated in a conventional plastic chip card and reduces costs and improves the reliability of the cards

The market for the contactless chip card is now not only limited to health insurance and bank cards as in the past, but now also includes ticket cards for public traffic, access and time control and security systems. The pay-back period has been only some month due to a first big business in the far east in the area of subway automatic access control and payment systems.

The overall time to market was slightly over one year. The pay back period is about one year. The return on investment more than 500%, since the basic investments may directly be used for further products.


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Detailed information

You can also benefit from microelectronics

Flip-chip technology provided PAV CARD GmbH with the means of improving its products and enhancing its market position. You can also achieve significant benefits by acquiring the right microelectronics technology and utilising it in your product or manufacturing process. You can get help from FUSE to realise this.

FUSE is a technology transfer programme, funded by the European Commission to stimulate the wider use of microelectronics technologies by European enterprises to increase their competitiveness and enhance their economic growth. The demonstrator described here is one of many examples in the public FUSE portfolio covering the whole spectrum of microelectronics technologies and spanning a wide range of applications and industry sectors.

FUSE provides you with:

  • Best practice in acquiring specific microelectronics technologies and conducting full development projects through the FUSE portfolio of real life demonstrator documents.
  • Local training and expert support to plan your innovation realistically and help you conduct your project successfully.

Further information and support relating to this and other demonstrators can be obtained from the addresses below.

Further information   Guiding Technology Transfer Node
For further information and support regarding this case study, please contact a Technology Transfer Node (TTN) in your region.
Homepage: http://www.fuse-network.com
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